Reaffirmed 2003. This standard is designed for use in conjunction with other documents such as the IEEE 1101 group of standards, the IEEE 896 group of standards, the IEEE 1596 group of standards, the IEEE 1014 group of standards, and ISO/IEC 10861: 1994. This standard is one of the IEEE P1156.x series for environmental specifications. It is intended to be used as a core specification. It contains minimum environmental withstand conditions applicable to computer systems and all of their associated components. It has been created to provide general environmental withstand conditions for one or more of the above listed computer buses or interconnect standards, and electronic equipment in general.
- Sponsor Committee
- C/MSC - Microprocessor Standards Committee
Learn More - Status
- Inactive-Reserved Standard
- Board Approval
- 1996-06-20
- History
-
- ANSI Approved:
- 1997-06-05
- Published:
- 1995-11-30
- Inactivated Date:
- 2019-11-07
Working Group Details
- Society
- IEEE Computer Society
Learn More - Sponsor Committee
- C/MSC - Microprocessor Standards Committee
Learn More - Working Group
-
1156_WG - Environmental Specifications Working Group
Learn More - IEEE Program Manager
- Tom Thompson
Contact - Working Group Chair
- Ralph Kearfott
No Active Projects
No Active Standards
No Superseded Standards
No Inactive-Withdrawn Standards
1156.1-1993
IEEE Standard Microcomputer Environmental Specifications for Computer Modules
Fundamental information on minimum environmental withstand conditions is provided. The information is intended to be used in those cases in which a generic or detail specification for a certain module has been prepared. The intent is to achieve uniformity and reproducibility in the test conditions for all modules that may make up larger systems and are purported to have a rated environmental performance level. The specifications pertain to both the natural and artificial environments to which modules may be exposed. These conditions include, but are not limited to, thermal, mechanical, electrical, and atmospheric stresses.